New Wafer Lapping Machine from Germany
An automated lapping machine that uses abrasive slurries to flatten and thin semiconductor wafers to precise tolerances before polishing. This equipment is classified under tariff item 8439.10.00 as machinery for making pulp of fibrous cellulosic material.
Duty Rate — Germany → Canada
0%
Import Tips
• Classify the lapping machine as new machinery for making pulp of fibrous cellulosic material and document its role in wafer preparation
• Verify if the machine is eligible for duty relief under the Machinery Program
• Ensure the equipment complies with Canadian electrical and safety regulations