New Wafer Edge Grinder from Japan
An edge profiling grinder used to chamfer and round semiconductor wafer edges, preventing chipping during handling and processing. This machine is classified under tariff item 8439.10.00 as machinery for making pulp of fibrous cellulosic material.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the edge grinder is declared as new machinery for making pulp of fibrous cellulosic material and provide details on its use in wafer processing
• Check if the grinder qualifies for duty-free import under the Machinery Program
• Confirm that the equipment meets Canadian safety standards for industrial machinery