New Semiconductor Wafer Slicing Saw from Japan
A high-precision inner-diameter saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss and damage. This machine is classified under tariff item 8439.10.00 as machinery for making pulp of fibrous cellulosic material.
Duty Rate — Japan → Canada
0%
Import Tips
• Declare the slicing saw as new machinery for making pulp of fibrous cellulosic material and include specifications on its precision and use
• Check if the saw is eligible for duty-free entry under the Machinery Program
• Ensure the equipment complies with Canadian import regulations for industrial machinery