Wafer Slicing Diamond Wire Guide from United States
A precision ceramic or carbide guide roller for diamond wire saws (heading 84.26) that slice silicon boules into thin wafers during semiconductor preparation. This part qualifies for tariff item 8431.49.00 due to its sole use in machinery of subheadings 84.26.11/19/30.
Duty Rate — United States → Canada
15%
Rate breakdown
26SUR1515%United States Surtax Order (2026) — 15% on US products
Import Tips
• Ensure the guide roller is declared as a part of diamond wire saws under heading 84.26
• Provide evidence of its ceramic or carbide composition and specific design for semiconductor applications
• Check if the guide is subject to any import permits for carbide products