Wafer Slicing Diamond Wire Guide from Mexico
A precision ceramic or carbide guide roller for diamond wire saws (heading 84.26) that slice silicon boules into thin wafers during semiconductor preparation. This part qualifies for tariff item 8431.49.00 due to its sole use in machinery of subheadings 84.26.11/19/30.
Duty Rate — Mexico → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Ensure the guide roller is declared as a part of diamond wire saws under heading 84.26
• Provide evidence of its ceramic or carbide composition and specific design for semiconductor applications
• Check if the guide is subject to any import permits for carbide products