Wafer Polisher Head Retaining Ring from United States
A consumable composite retaining ring that holds wafers in place against the polishing pad during CMP on heading 84.26 polishers. This part is classified as a principal wearing part under tariff item 8431.49.00.
Duty Rate — United States → Canada
15%
Rate breakdown
26SUR1515%United States Surtax Order (2026) — 15% on US products
Import Tips
• Ensure the retaining ring is declared as a part of wafer polishers under heading 84.26
• Provide specifications showing its composite material and specific design for CMP applications
• Check if the ring is subject to any anti-dumping duties on composite products