Wafer Lapping Machine Conditioning Ring from United States
A cast iron or composite conditioning ring for wafer lappers (heading 84.26) that dresses the lapping plate surface for flatness control in semiconductor wafer preparation. This part is specific to machinery in subheadings 84.26.11/19/30 and is classified under tariff item 8431.49.00.
Duty Rate — United States → Canada
15%
Rate breakdown
26SUR1515%United States Surtax Order (2026) — 15% on US products
Import Tips
• Classify the conditioning ring under 8431.49.00 only if it is solely or principally used with wafer lappers of heading 84.26
• Provide technical data showing its specific design for semiconductor wafer preparation
• Verify if the ring is subject to any import permits for composite materials