Semiconductor Wafer Polisher Slurry Nozzle from United States
A sapphire or silicon carbide nozzle assembly for delivering polishing slurry precisely onto wafer polishers (heading 84.26) in semiconductor fabs. This part is classified under tariff item 8431.49.00 for its principal use in designated subheading machinery.
Duty Rate — United States → Canada
15%
Rate breakdown
26SUR1515%United States Surtax Order (2026) — 15% on US products
Import Tips
• Classify the nozzle under 8431.49.00 only if it is solely or principally used with wafer polishers of heading 84.26
• Provide technical specifications showing its sapphire or silicon carbide composition
• Verify if the nozzle is subject to any export controls on semiconductor technology