Wafer Weight Gauging Platform with Electronic Strain Gauges from Japan
This specialized platform scale is equipped with electronic strain gauges for high-precision weighing of semiconductor wafers post-slicing or lapping, detecting weight variations to gauge material removal uniformity. It is classified under 8423.89.00 as other weighing machinery, not being a balance of sensitivity 5 cg or better.
Duty Rate — Japan → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Confirm the platform's sensitivity is less than 5 cg to avoid classification as a balance
• Provide documentation on the strain gauge technology to support the weighing function
• Check if the platform is part of a larger system, which could affect classification