Semiconductor Wafer Edge Grinder Weight Check Scale from Japan
This compact electronic scale is integrated post-wafer grinding, using electronic sensors to gauge weight loss for diameter precision in semiconductor wafer preparation. It falls under 8423.89.00 as other weighing machinery, as it is not a balance of high sensitivity and is not elsewhere specified.
Duty Rate — Japan → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Ensure the scale is declared separately if imported with the grinder, as classification may differ if presented as a complete machine
• Provide specifications showing the scale's weighing function
• Consider if the scale is a part of a machine, which may affect classification