Wafer Polishing Machine from Japan
Chemical mechanical polishing (CMP) machines for semiconductor wafers use rotating pads and temperature-controlled slurries to achieve mirror-finish surfaces with atomic-level flatness required for lithography. This equipment is classified under tariff item 8419.89.00 due to its temperature-controlled processing function.
Duty Rate — Japan → Canada
0%
Import Tips
• Document the temperature control features of the polishing machine to support classification
• Provide technical specifications showing the temperature-change function
• Verify if the machine is subject to any semiconductor equipment regulations