Wafer Lapping Machine from Japan
This industrial machine laps semiconductor wafers to precise flatness using slurries and temperature-controlled platens for surface preparation. It is classified under tariff item 8419.39.00 because the lapping process involves cooling and drying stages that are integral to the machine's function. The temperature control prevents wafer damage and ensures consistent surface quality.
Duty Rate — Japan → Canada
0%
Import Tips
• Confirm that the machine's primary function is temperature treatment (cooling/drying) during lapping; if lapping is the principal function, other headings may apply
• Keep records of the machine's specifications to support classification
• Check if the equipment qualifies for accelerated duty rates under the Most-Favoured-Nation tariff or a trade agreement