Wafer Slicing Saw Vacuum Pump from United States
A vacuum pump integrated with diamond wire wafer slicing saws to remove slurry and maintain a clean environment during slicing of semiconductor wafers from boules. It ensures efficient slurry extraction and a clean cutting environment. This pump falls under tariff item 8414.10.00 as a vacuum pump used in semiconductor wafer slicing.
Duty Rate — United States → Canada
PGA flags (2)Show detailsHide detailsECCCVehicles and Engine Emissions ProgramRequiredHCConsumer Products SafetyMay be required
- ECCC
Vehicles and Engine Emissions Program · Required
ENVIRONMENT AND CLIMATE CHANGE CANADA: ECCC Vehicles and Engine Emissions Program requires review / declaration data. CBSA's Single Window matching criteria match this classification number (Equal To 8414100000).
- HC
Consumer Products Safety · May be required
May require HC Consumer Products Safety depending on intended use (HC21) and Canadian product category (HC29, HC30, HC31, HC32, HC33, HC34, HC35, HC36, HC37); or intended use (HC22, HC23, HC24, HC26, HC27) and Canadian product category (HC37). Matching criteria: Equal To 8414100000; Equal To 8414100000. Logic: MATCH IF (Valid HS Code) AND (Intended Use Code) AND (Valid Canadian Product Category).
CBSA Single Window matching criteria, unknown
Import Tips
• Classify the pump under 8414.10.00 as a vacuum pump, separate from the slicing saw
• Provide technical specifications to confirm it is a vacuum pump
• Be aware of any import documentation requirements for semiconductor equipment