Czochralski Puller Wafer Slicing Coolant Pump Manifold from China
This multi-port manifold distributes coolant to wafer slicing saws in Czochralski systems for semiconductor boule processing. It ensures uniform cooling during diamond wire slicing, preventing thermal damage. As a part of a liquid pump, it is classified under tariff item 8413.91.00.
Duty Rate — China → Canada
0%
Import Tips
• Declare the manifold as a part of a liquid pump under 8413.91.00, not as a standalone piping component
• Provide the pump system details and the slicing application to support classification
• Ensure the manifold's ports and materials are clearly documented for CBSA