Wafer Dicing Coolant Pump from Japan
High-pressure pump for coolant in laser or mechanical wafer dicing saws separating finished semiconductor devices. It prevents chipping and thermal damage during the dicing process. This pump is essential for maintaining wafer integrity during device separation.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the pump is classified under 8413.81.00 as an 'other pump' for liquids
• Provide CBSA with technical specifications showing its use in wafer dicing
• Verify if the pump qualifies for duty relief under semiconductor equipment provisions