Semiconductor Wafer Slicing Hydraulic Ram from Japan
Heavy-duty hydraulic ram providing linear thrust for diamond wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. This ram is a part of linear acting hydraulic power engines.
Duty Rate — Japan → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Classify the hydraulic ram as a part of linear acting hydraulic power engines under 8412.90.00
• Confirm it is not a complete motor
• Provide documentation on its use in wafer slicing