Indium Bump Preform from Japan
Preformed indium spheres for flip-chip bonding in microelectronics packaging. As shaped articles of indium, these spheres are classified under tariff item 8112.99.00, being distinct from unwrought indium or waste.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the spheres are not considered unwrought indium; provide evidence of shaping or forming
• Document the purity and dimensions for classification
• If the preforms are for electronics, verify if they are part of a machine under Section XVI