Synthetic Diamond Micron Powder for Wire Sawing from Japan
Ultra-fine synthetic diamond powder (90%+ passing 0.5mm sieve) used in wire sawing for semiconductor wafers and optical glass. This powder form is excluded from tariff item 7102.29.00 and should be classified under heading 7105.
Duty Rate — Japan → Canada
0%
Import Tips
• This product is not classifiable under 7102.29.00 as it is in powder form
• Classify under 7105.10.00 for diamond powder
• Ensure the powder is 90%+ passing 0.5mm sieve to qualify as powder