Precision Diamond Grinding Disc from Japan
An ultra-thin disc of agglomerated natural diamond for grinding thin wafers in electronics production. It is a framework-free abrasive tool for precision grinding, aligning with this tariff item.
Duty Rate — Japan → Canada
0%
PGA flags (1)Show detailsHide detailsCBSACBSA FPA Risks (Soil)Required
- CBSA
CBSA FPA Risks (Soil) · Required
Canada Border Services Agency: CBSA CBSA FPA Risks (Soil) requires review / declaration data. CBSA's Single Window matching criteria match this classification number (Within Range 6801000000–6815919000).
CBSA Single Window matching criteria, unknown
Import Tips
• Confirm the disc has no mounting hub or arbor; standalone discs qualify
• Provide technical data on the diamond grit size and bond for customs
• If used in semiconductor manufacturing, check for any end-use provisions